
A Look at Material Advancements, Novel Process Development and Dealing with Defects
The abstract of a paper recently presented at SMTA Dallas by Universal Instruments‘ Advanced Process Lab.
The abstract of a paper recently presented at SMTA Dallas by Universal Instruments‘ Advanced Process Lab.
Specialized nozzle design delivers near perfect yields for complex connector placement.
Have you ever looked at a computer motherboard, seen mostly surface mounted components and wondered why the designers chose to use leaded electrolytic capacitors in their design?
Universal Instruments’ proprietary Topside Alignment Placement (TAP) process aligns placement based on top features, enabling high accuracy placement for a wide range of applications.
Universal Instruments views customer training as one of the most critical services we provide to customers and is proud to offer best-in-class training at our global facilities.