Universal Holds Technology Seminars at NEPCON Shenzhen
Seminars to focus on key challenges and solutions for the Chinese electronics manufacturing market
August 2014
Monthly Archives
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Universal Holds Technology Seminars at NEPCON Shenzhen
Seminars to focus on key challenges and solutions for the Chinese electronics manufacturing market
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Advanced Process Laboratory (APL) – Catheter Board Process Flow
Universal Instruments’ Advanced Process Laboratory will present the precise and robust process for a leading-edge heart catheter circuit board at NEPCON Shenzhen. To sign up for this presentation, click http://www.uic.com/nepcon_shenzhen_seminar_en/.
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Universal Instruments Presents at iNEMI Workshop on Board Assembly & Test Technology on August 25, Shenzhen, China
August 17, 2014 – Universal Instruments’ Dr. Babak Arfaei is going to present “Effect of Sn Grain Morphology on Reliability of Lead Free Solder Joints in Thermal Cycling Tests” on August 25 at iNEMI Workshop on Board Assembly & Test Technology in Shenzhen, China.
In an effort to deliver state-of-the-art components that provide more functionality generation after generation, component designers are utilizing significantly miniaturized electric interconnects. The decreased scale of operation for these components is causing a change in the micro-structure and consequently alters the thermal fatigue performance of these solder joints.
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Next Generation PoP – Shrinking the Package-on-Package
August 1, 2014 – It has been more than 5 years when the first generation of Package-on-Package came into form. The primary objective is to combine the memory and the application specific integrated circuit (ASIC) to use much lesser real property this shrinking the overall package. However, it is known fact that even with this 3D assembly technology, the demand for continuous higher functionality and smaller form factor is ever present.
In discussing about the continuing shrinking form factor,
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